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CVE
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CVE-2016-2063Date: (C)2016-08-25   (M)2023-12-22


Stack-based buffer overflow in the supply_lm_input_write function in drivers/thermal/supply_lm_core.c in the MSM Thermal driver for the Linux kernel 3.x, as used in Qualcomm Innovation Center (QuIC) Android contributions for MSM devices and other products, allows attackers to cause a denial of service or possibly have unspecified other impact via a crafted application that sends a large amount of data through the debugfs interface.

CVSS Score and Metrics +CVSS Score and Metrics -

CVSS V3 Severity:CVSS V2 Severity:
CVSS Score : 7.8CVSS Score : 4.6
Exploit Score: 1.8Exploit Score: 3.9
Impact Score: 5.9Impact Score: 6.4
 
CVSS V3 Metrics:CVSS V2 Metrics:
Attack Vector: LOCALAccess Vector: LOCAL
Attack Complexity: LOWAccess Complexity: LOW
Privileges Required: LOWAuthentication: NONE
User Interaction: NONEConfidentiality: PARTIAL
Scope: UNCHANGEDIntegrity: PARTIAL
Confidentiality: HIGHAvailability: PARTIAL
Integrity: HIGH 
Availability: HIGH 
  
Reference:
BID-92381
https://us.codeaurora.org/cgit/quic/la/kernel/msm-3.10/commit/?id=ab3f46119ca10de87a11fe966b0723c48f27acd4
https://www.codeaurora.org/stack-overflow-msm-thermal-driver-allows-kernel-memory-corruption-cve-2016-2063

CPE    1
cpe:/o:linux:linux_kernel
CWE    1
CWE-119

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