| CVE-2018-11277 | Date: (C)2018-10-04 (M)2023-12-22 |
In Snapdragon (Automobile, Mobile, Wear) in version MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SDA660, the com.qualcomm.embms is a vendor package deployed in the system image which has an inadequate permission level and allows any application installed from Play Store to request this permission at install-time. The system application interfaces with the Radio Interface Layer leading to potential access control issue.
CVSS Score and Metrics +CVSS Score and Metrics -| CVSS V3 Severity: | CVSS V2 Severity: |
| CVSS Score : 7.8 | CVSS Score : 4.6 |
| Exploit Score: 1.8 | Exploit Score: 3.9 |
| Impact Score: 5.9 | Impact Score: 6.4 |
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| CVSS V3 Metrics: | CVSS V2 Metrics: |
| Attack Vector: LOCAL | Access Vector: LOCAL |
| Attack Complexity: LOW | Access Complexity: LOW |
| Privileges Required: LOW | Authentication: NONE |
| User Interaction: NONE | Confidentiality: PARTIAL |
| Scope: UNCHANGED | Integrity: PARTIAL |
| Confidentiality: HIGH | Availability: PARTIAL |
| Integrity: HIGH | |
| Availability: HIGH | |
| | |
